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5W/mK PCM Phase Change Material Thermal Low Melting Point Memory Modules

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Dongguan Ziitek Electronical Material and Technology Ltd.

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5W/mK PCM Phase Change Material Thermal Low Melting Point Memory Modules

Brand Name : Ziitek

Model Number : TIC800G

Certification : RoHS

Place of Origin : China

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 1000000 pcs/month

Delivery Time : 3-6 work days

Packaging Details : 24*23*12cm

keyword : Ultra thin thermal conductive low melting point thermal pad

feature : low melting point

thermal conductivity : 5W/mK

Applicatoin : Memory Modules

features : low melting pcm

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Memory Modules applicative grey Ultra thin thermal conductive low melting point thermal pad pcm phase change materials

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

The TIC™800G Series is low melting point thermal interface material. At 50℃, The TIC™800G Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800G Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
The TIC™800G Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.

TIC800G Series Datasheet-(E)-REV01.pdf

Features

> 0.014℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required

Applications

> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

Typical Properties of TIC™800G Series
Product Name	TIC^TM805G	TIC^TM808G	TIC^TM810G	TIC^TM812G	Testing standards
Color	Gray	Gray	Gray	Gray	Visual
Composite Thickness	0.005" (0.126mm)	0.008" (0.203mm)	0.010" (0.254mm)	0.012" (0.305mm)
Thickness Tolerance	±0.0008'' (±0.019mm)	±0.0008" (±0.019mm)	±0.0012" (±0.030mm)	±0.0012" (±0.030mm)
Density	2.6g/cc				Helium Pycnometer
Work Temperature	-25℃～125℃
phase transition temperature	50℃~60℃
Thermal conductivity	5.0 W/mK				ASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa)	0.013℃-in²/W	0.014℃-in²/W	0.038℃-in²/W	0.058℃-in²/W	ASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa)	0.08℃-cm²/W	0.09℃-cm²/W	0.25℃-cm²/W	0.37℃-cm²/W	ASTM D5470 (modified)

Standard Thicknesses:
0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.012"(0.305mm)

Consult the factory alternate thickness.

Standard Sizes:
9" x 18"(228mm x 457mm) 9" x 400'(228mm x 121M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement:
No reinforcement is necessary.

5W/mK PCM Phase Change Material Thermal Low Melting Point Memory Modules

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Product Tags:

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5W/mK PCM Phase Change Material Thermal Low Melting Point Memory Modules

5W/mK PCM Phase Change Material Thermal Low Melting Point Memory Modules

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5W/mK PCM Phase Change Material Thermal Low Melting Point Memory Modules Images