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2.2g/Cc PCM Phase Change Material Pad Power Semiconductors Laptop Cooling

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Dongguan Ziitek Electronical Material and Technology Ltd.

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2.2g/Cc PCM Phase Change Material Pad Power Semiconductors Laptop Cooling

Brand Name : Ziitek

Model Number : TIC800Y

Certification : RoHS

Place of Origin : China

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 1000000 pcs/month

Delivery Time : 3-6 work days

Packaging Details : 24*23*12cm

keyword : RoHS Compliant yellow thermal phase change

Applicatoin : Power semiconductors

Density : 2.2g/cc

thermal conductivity : 0.95 W/mK

phase transition temp : 50℃~60℃

material : phase change pad

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Power semiconductors applied RoHS Compliant yellow thermal phase change pad pcm TIC 800Y

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

The TIC™800Y Series is low melting point thermal interface material. At 50℃, The TIC™800Y Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800Y Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

The TIC™800Y Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.

Features

> 0.024℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required

Applications

> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

Typical Properties of TIC™800Y Series
Product Name	TIC^TM803Y	TIC^TM805Y	TIC^TM808Y	TIC^TM810Y	Testing standards
Color	Yellow	Yellow	Yellow	Yellow	Visual
Composite Thickness	0.003" (0.076mm)	0.005" (0.126mm)	0.008" (0.203mm)	0.010" (0.254mm)
Thickness Tolerance	±0.0006" (±0.016mm)	±0.0008" (±0.019mm)	±0.0008" (±0.019mm)	±0.0012" (±0.030mm)
Density	2.2g/cc				Helium Pycnometer
Work temperature	-25℃～125℃
phase transition temperature	50℃~60℃
Thermal conductivity	0.95 W/mK				ASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa)	0.021℃-in²/W	0.024℃-in²/W	0.053℃-in²/W	0.080℃-in²/W	ASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa)	0.14℃-cm²/W	0.15℃-cm²/W	0.34℃-cm²/W	0.52℃-cm²/W	ASTM D5470 (modified)

Standard Thicknesses:
0.003"(0.076mm) 0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm)
Consult the factory alternate thickness.

Standard Sizes:
9" x 18"(228mm x 457mm) 9" x 400'(228mm x 121M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement:
No reinforcement is necessary.

2.2g/Cc PCM Phase Change Material Pad Power Semiconductors Laptop Cooling

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

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2.2g/Cc PCM Phase Change Material Pad Power Semiconductors Laptop Cooling

2.2g/Cc PCM Phase Change Material Pad Power Semiconductors Laptop Cooling

thermal phase change material

phase change thermal pad

2.2g/Cc PCM Phase Change Material

2.2g/Cc PCM Phase Change Material Pad Power Semiconductors Laptop Cooling Images